What's New
Welcome Address from the Chairman
Dear Colleagues,
It is my great pleasure and honor to welcome you to the 16th International Conference on Shot Peening (ICSP16), which will be held at the Nagaragawa Convention Center in Gifu, Japan, from September 11 to 14, 2028.
The International Conference on Shot Peening has a long and distinguished history as a leading international forum for researchers, engineers, and industrial professionals involved in shot peening and related surface enhancement technologies. ICSP16 will provide an excellent opportunity to share the latest scientific achievements and industrial applications, exchange ideas, and strengthen collaboration within our global community.
Today, shot peening plays an increasingly important role in improving the fatigue strength, durability, reliability, and performance of components in industries such as aerospace, automotive, energy, and advanced manufacturing. As industry seeks higher performance, longer service life, and greater sustainability, the importance of these technologies will continue to grow.
The conference will take place in Gifu, located in the heart of Japan and easily accessible from Nagoya. Gifu is renowned for the beautiful Nagara River and the traditional Ukai (cormorant fishing), with a history spanning more than 1,300 years. We hope you will enjoy not only the technical program but also the culture, hospitality, and natural beauty of Japan.
On behalf of the Organizing Committee, I sincerely invite you to join us at ICSP16. We look forward to welcoming you to Gifu in September 2028 and making ICSP16 a memorable and fruitful conference for everyone.
Call for Abstracts
We warmly invite researchers, engineers, and industry professionals to submit papers presenting their latest research findings, technological developments, and practical applications related to shot peening and associated surface treatment technologies. Contributions addressing both fundamental research and industrial applications are welcome.
[ Main Topics ]
- ― Industrial Applications
- Automotive, aerospace, energy, medical, offshore, railway, and other industrial applications
- Applications to welded structures, gears, springs, turbine components, and other mechanical parts
- ― Fatigue, Fracture, and Material Performance
- Effects of shot peening on steels, aluminum alloys, titanium alloys, and other materials
- ― Residual Stress and Surface Integrity
- ― Modelling and Simulation
- Numerical modelling and simulation of shot peening processes
- Prediction of residual stress, surface characteristics, and fatigue life
- ― Peening Equipment, Media, and Process Control
- ― Laser Peening and Alternative Peening Processes
- ― Ultrasonic peening and ultrasonic impact treatment
- ― Cavitation peening
- ― Deep rolling and other mechanical surface treatment processes
- ― Fine Particle Peening, Deposition and Advanced Surface Engineering
- ― Innovative Technologies and Future Applications
- Sustainable and environmentally responsible peening technologies
- Artificial intelligence, smart manufacturing, and digital process management
The important dates for the submission of Abstracts have been announced on the official ICSP16 website. We would also appreciate it if you could share this invitation with interested colleagues and students.
Remarks : Depending on the number of submitted abstracts, there is possibility that a oral presentation may be scheduled for the poster session.
- Yoshihiro Watanabe
- Chairman, ICSP16 Organizing Committee
- 16th International Conference on Shot Peening
Sponsorship Opportunities
A technical exhibition will be organized during the conference, providing companies and organizations with an opportunity to introduce their products, equipment, technologies, and services to international participants specializing in shot peening and surface engineering.
ICSP16 will offer the following sponsorship categories: Gold Sponsor, Silver Sponsor, Bronze Sponsor
Depending on the sponsorship category, benefits are expected to include:
・Free Exhibition booth space (Number of the booth depends on Sponsor categories)
・Company logo placement on the official conference website and program
・Company logo display at the conference venue
・Invitations to the conference banquet
Exhibition Opportunities
Exhibition booths are planned to be located in or near the conference networking area. The exhibition fee is JPY 600,000 per booth and includes one complimentary invitation to the conference banquet. Detailed information regarding specifications, application procedures, and deadlines will be announced at a later date.
We sincerely invite researchers, engineers, companies, and organizations worldwide to participate in and support ICSP16 in Gifu, Japan. We look forward to welcoming you to ICSP16.